AMD propulse le datacenter haute performance vers un nouvel horizon

Cautionary Statement

This press release contains forward-looking statements concerning Advanced Micro Devices, Inc. (AMD) including the features, functionality, availability, timing, deployment and expectations of AMD future products and technologies, including “Zen 2,” “Zen 3,” “Zen 4,” “Rome,” AMD Radeon Instinct™ MI60 and MI50 accelerators and the ROCm 2.0 open software platform; AMD driving growing adoption in its CPUs and GPUs across cloud, enterprise and HPC customers; AMD being well positioned to accelerate its momentum through the introduction of AMD’s datacenter portfolio in the coming quarters; and expected benefits from EPYC™ based AWS R5, M5 and T3 instances, which are made pursuant to the Safe Harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are commonly identified by words such as "would," "intends," "believes," "expects," "may," "will," "should," "seeks," "intends," "plans," "pro forma," "estimates," "anticipates," or the negative of these words and phrases, other variations of these words and phrases or comparable terminology. Investors are cautioned that the forward-looking statements in this document are based on current beliefs, assumptions and expectations, speak only as of the date of this document and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Such statements are subject to certain known and unknown risks and uncertainties, many of which are difficult to predict and generally beyond AMD's control, that could cause actual results and other future events to differ materially from those expressed in, or implied or projected by, the forward-looking information and statements. Material factors that could cause actual results to differ materially from current expectations include, without limitation, the following: Intel Corporation’s dominance of the microprocessor market and its aggressive business practices may limit AMD’s ability to compete effectively; AMD has a wafer supply agreement with GF with obligations to purchase all of its microprocessor and APU product requirements, and a certain portion of its GPU product requirements, from GLOBALFOUNDRIES Inc. (GF) with limited exceptions. If GF is not able to satisfy AMD’s manufacturing requirements, its business could be adversely impacted; AMD relies on third parties to manufacture its products, and if they are unable to do so on a timely basis in sufficient quantities and using competitive technologies, AMD’s business could be materially adversely affected; failure to achieve expected manufacturing yields for AMD’s products could negatively impact its financial results; the success of AMD’s business is dependent upon its ability to introduce products on a timely basis with features and performance levels that provide value to its customers while supporting and coinciding with significant industry transitions; if AMD cannot generate sufficient revenue and operating cash flow or obtain external financing, it may face a cash shortfall and be unable to make all of its planned investments in research and development or other strategic investments; the loss of a significant customer may have a material adverse effect on AMD; AMD’s receipt of revenue from its semi-custom SoC products is dependent upon its technology being designed into third-party products and the success of those products; AMD products may be subject to security vulnerabilities that could have a material adverse effect on AMD; data breaches and cyber-attacks could compromise AMD’s intellectual property or other sensitive information, be costly to remediate and cause significant damage to its business and reputation; AMD’s operating results are subject to quarterly and seasonal sales patterns; global economic uncertainty may adversely impact AMD’s business and operating results; AMD may not be able to generate sufficient cash to service its debt obligations or meet its working capital requirements; AMD has a large amount of indebtedness which could adversely affect its financial position and prevent it from implementing its strategy or fulfilling its contractual obligations; the agreements governing AMD’s notes and the Secured Revolving Line of Credit impose restrictions on AMD that may adversely affect its ability to operate its business; the markets in which AMD’s products are sold are highly competitive; AMD's issuance to West Coast Hitech L.P. (WCH) of warrants to purchase 75 million shares of its common stock, if and when exercised, will dilute the ownership interests of its existing stockholders, and the conversion of the 2.125% Convertible Senior Notes due 2026 may dilute the ownership interest of its existing stockholders, or may otherwise depress the price of its common stock; uncertainties involving the ordering and shipment of AMD’s products could materially adversely affect it; the demand for AMD’s products depends in part on the market conditions in the industries into which they are sold. Fluctuations in demand for AMD’s products or a market decline in any of these industries could have a material adverse effect on its results of operations; AMD’s ability to design and introduce new products in a timely manner is dependent upon third-party intellectual property; AMD depends on third-party companies for the design, manufacture and supply of motherboards, software and other computer platform components to support its business; if AMD loses Microsoft Corporation’s support for its products or other software vendors do not design and develop software to run on AMD’s products, its ability to sell its products could be materially adversely affected; and AMD’s reliance on third-party distributors and AIB partners subjects it to certain risks.  Investors are urged to review in detail the risks and uncertainties in AMD's Securities and Exchange Commission filings, including but not limited to AMD's Quarterly Report on Form 10-Q for the quarter ended September 29, 2018.

AMD, the AMD Arrow logo, EPYC, Radeon and combinations thereof, are trademarks of Advanced Micro Devices, Inc. Other names are for informational purposes only and may be trademarks of their respective owners.

1. Estimated increase in instructions per cycle (IPC) is based on AMD internal testing for “Zen 2” across microbenchmarks, measured at 4.53 IPC for DKERN +RSA compared to prior “Zen 1” generation CPU (measured at 3.5 IPC for DKERN + RSA) using combined floating point and integer benchmarks.
2. NAP-42 – AMD EPYC™ 7601 processor supports up to 8 channels of DDR4-2667, versus the Xeon Platinum 8180 processor at 6 channels of DDR4-2667. NAP-43 – AMD EPYC 7601 processor includes up to 32 CPU cores versus the Xeon Platinum 8180 processor with 28 CPU cores.
NAP-44 – A single AMD EPYC™ 7601 processor offers up to 2TB/processor (x 2 = 4TB), versus a single Xeon Platinum 8180 processor at 768Gb/processor (x 2 = 1.54TB). NAP-56 – AMD EPYC™ processor supports up to 128 PCIe® Gen 3 I/O lanes (in both 1 and 2-socket configuration), versus the Intel® Xeon® SP Series processor supporting a maximum of 48 lanes PCIe®  Gen 3 per CPU, plus 20 lanes in the chipset (max of 68 lanes on 1 socket and 116 lanes on 2 socket). Based on “Zen 2” design parameters versus “Zen1” and currently shipping products – core count increase from 32 to up to 64 per socket.  Memory bandwidth with up to 3200Gb/s memory speed across eight memory channels, I/O leadership extending to PCIeGen4.
3. Per Silicon Labs, provider of the PCIe Gen 4 solutions. (website here: https://www.silabs.com/community/blog.entry.html/2015/12/04/what_is_pcie_gen4a-oobp). PCIe Gen4 is a new standardized data transfer bus that will double the data transfer rate per lane of the prior Gen3 revision from 8.0 GT/s (gigatransfers/second) to 16.0 GT/s. This means that a single PCIe Gen4 interconnection will allow data rate transfers of up to 2GB/s (gigabytes/second), and a full 16 slot PCIe Gen4 interconnection for graphics cards and high-end solid state drives will allow data transfer rates of up to 32GB/s.
4. Testing performed by AMD Engineering as of October 2018 using AMD reference system with a pre-production “Rome” engineering sample, where “Rome” scored approximately 2x higher compared to “Naples” System.
5. Estimated generational increase based upon AMD internal design specifications for “Zen 2” compared to “Zen 1”.  “Zen 2” has 2X the core density of “Zen 1”, and when multiplied by 2X peak FLOPs per core, at the same frequency, results in 4X the FLOPs in throughput.
6. Estimates based on AMD internal testing as of November 6, 2018 in AMD “Ethanol” reference system (Oct 2018?) AMD EPYC™-based system configuration with AMD “Rome” Development Chassis with  an EthanolX development board featuring a single next generation AMD EPYC (“Rome”) processor with a total of XXXXX DIMMs at XXXXX; versus Intel -based system configured with Supermicro’s SYS-1029U-TRTP; OS: Ubuntu 7.3.0-27ubuntu1~18.04; Linux: 4.15.0-36-generic; Compiler: GCC 7.3.0 with 2x Intel(R) Xeon(R) Platinum 8180M CPU, 24x32GB at 2666 MHz. The AMD “Rome” 1P server completes the C-Ray demo in ~ XXXXX sec and the Intel 8180M completes the benchmark in ~ XXXXX sec.  Benchmark testing data redacted by AMD for confidentiality purposes, full disclosure will be available after launch.
7. As of Oct 22, 2018. The results calculated on for Radeon Instinct MI60 designed with Vega 7nm FinFET process technology resulted in 29.5 TFLOPS half precision (FP16), 14.8 TFLOPS single precision (FP32) and 7.4 TFLOPS double precision (FP64) peak theoretical floating-point performance. This performance increase is achieved with an improved transistor count of 13.2 billion on a smaller die size of 331.46mm2 then previous Gen MI25 GPU products with the same 300W power envelope.
The results calculated for Radeon Instinct MI50 designed with Vega 7nm FinFET process technology resulted in 26.8 TFLOPS peak half precision (FP16), 13.4 TFLOPS peak single precision (FP32) and 6.7 TFLOPS peak double precision (FP64) floating-point performance. This performance increase is achieved with an improved transistor count of 13.2 billion on a smaller die size of 331.46mm2 than previous Gen MI25 GPU products with the same 300W power envelope.
The results calculated for Radeon Instinct MI25 GPU based on the “Vega10” architecture resulted in 24.6 TFLOPS peak half precision (FP16), 12.3 TFLOPS peak single precision (FP32) and 768 GFLOPS peak double precision (FP64) floating-point performance. This performance is achieved with a transistor count of 12.5 billion on a die size of 494.8mm2 with 300W power envelope.
AMD TFLOPS calculations conducted with the following equation for Radeon Instinct MI25, MI50, and MI60 GPUs: FLOPS calculations are performed by taking the engine clock from the highest DPM state and multiplying it by xx CUs per GPU. Then, multiplying that number by xx stream processors, which exist in each CU. Then, that number is multiplied by 2 FLOPS per clock for FP32 and 4 FLOPS per clock for FP16. To calculate FP64 TFLOPS rate for Vega 7nm products MI50 and MI60 a 1/2 rate is used and for “Vega10” architecture based MI25 a 1/16th rate is used.
TFLOP calculations for MI50 and MI60 GPUs can be found at https://www.amd.com/en/products/professional-graphics/instinct-mi50 and https://www.amd.com/en/products/professional-graphics/instinct-mi60
GFLOPS per Watt

Industry supporting documents / web pages:
https://www.tsmc.com/english/dedicatedFoundry/technology/7nm.htm
https://www.globalfoundries.com/sites/default/files/product-briefs/product-brief-7lp-7nm-finfet-technology.pdf
AMD has not independently tested or verified external/third party results/data and bears no responsibility for any errors or omissions therein. RIV-2
8. Radeon Instinct™ MI60 contains 13.2 billion transistors on a package size of 331.46mm2, while the previous generation Radeon Instinct™ MI25 had 12.5 billion transistors on a package size of 494.8mm2 – a 58% improvement in number of transistors per mm2.